Micropore Laser Perforation Machine for semiconductor

Short Description:

Application: Glass, organics, metals, ceramics, etc.

Minimum hole diameter : 5μm

Accuracy :±4μm,

Local feature accuracy:  <3μm

Product Detail

Product Tags

The minimum processing micropore diameter is 5μm, the overall processing accuracy is ±4μm, the local feature accuracy is less than 3μm, and the processing width is 300*300mm. .

Mainly used for: microelectronic device manufacturing, printing template preparation, biochip preparation, precision mold forming, instrumentation precision parts manufacturing

1. Using high-power and high-stability UV laser to directly ablate the gasification material, with a μm-level processing aperture and a μm-level heat-affected zone;

2. High-speed and high-precision control of beam deflection through imported precision galvanometers to achieve high-speed small-format precision micro-hole processing;

3. High-speed and high-precision large-format micro-hole processing is realized by the translation of the micron-level high-speed linear motor platform;

4. The Z-axis is electrically adjustable to adapt to materials of different thicknesses and to meet specific taper hole processing requirements;

5. The range axis super-resolution industrial camera is used for full-frame error correction of the galvanometer, ultra-high-precision focusing, and online measurement to ensure the long-term stability and accuracy of the system;

6. The system adopts marble countertops to improve the overall stability of the system, and all mechanical components are carefully selected to ensure long-term accuracy;

7. The minimum processing micropore diameter is 5μm, the overall processing accuracy is ±4μm, the local feature accuracy is less than 3μm, and the processing width is 300*300mm;

8. It is used for precision micromachining of metals, ceramics, silicon wafers, glass, organics and other materials, such as micro-hole processing and precision cutting.

Compared with EDM micro-hole processing, mechanical drilling, chemical corrosion, mechanical punching, etc., laser precision micro-hole machining has the following advantages:

High speed (up to 4000 holes per second)

High precision (<3μm)

No material restrictions (metals, ceramics, silicon wafers, organics, etc.)

Programmable hole pattern (minimum 5μm, specific taper hole)

Distribution can be customized (processing width 300mm*300mm), no mold and mask required

No pollution and no consumables

direct processing

Items Parameter FM-UVM3A FM-UVM3B
Laser wave 355nm
Power >3W@40kHz (3-40W optional)
modulating frequency 1~200kHz
Pulse width 15ns@40kHz
beam quality  <1.2
Galvo Scan area <50*50mm <15*15mm
Repeatability accuracy <1um
Positioning accuracy ≤±3um
X Y tables Travel 300*300mm (600*600mm optional)
Positioning resolution 0.1um
Repeatability accuracy ≤±1um
Positioning accuracy ≤±3um
Acceleration ≤1G
Speed ≤200mm/s
Z axis Travel 150mm
Repeatability accuracy ≤±3um
Positioning accuracy ≤±5um

CCD monitoring positioning

Camera five-megapixel
Optical magnification 10X
region splicing accuracy ±3μm
Processing Minimum spot 8um 5um
Hole processing accuracy ±5um
Repeatability accuracy ≤±1um
Available materials for procesing Glass, organics, metals, ceramics, etc.
GGGGApplication Pipe bottle ok good
die bottle ok good
Plastic bottle not good ok
Soft bags No available ok
Coolant system Water coolant (1500W cooling capacity )
Power supply 220V, 50~60HZ, 1 phase or customized
Power ≤2000W
Measure(mm) 1200*1200*1900mm
Weight (KG) 1200Kg

Note: Constant temperature (25±0.5℃), obtained after preheating for 30 minutes

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